Display device having a plurality of main pads, a plurality of redundant pads, and a light-emitting device in a display area

ABSTRACT

A display device is provided. The display device includes a substrate, a plurality of signal lines disposed on the substrate, and a plurality of display units disposed on the substrate. At least one of the signal lines includes a main line, a plurality of first branch lines electrically connected to the main line, and a plurality of second branch lines electrically connected to the main line. At least one of the display units includes a plurality of main pads, a plurality of redundant pads, and a light-emitting device electrically connected to the main pads. At least one of the main pads is electrically connected to at least one first branch line, and at least one of the redundant pads is electrically connected to at least one second branch line.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of pending U.S. patent applicationSer. No. 16/013,074, filed Jun. 20, 2018 and entitled “A DISPLAY DEVICEHAVING A PLURALITY OF MAIN PADS, A PLURALITY OF REDUNDANT PADS, AND ALIGHT-EMITTING DEVICE”, the entirety of which is incorporated byreference herein.

BACKGROUND Technical Field

The present disclosure relates to a display device, and it relates tothe design of redundant pads in the display device.

Description of the Related Art

Electronic products that come with a display panel, such as smartphones,tablets, notebooks, monitors, and TVs, have become indispensablenecessities in modern society. With the flourishing development of suchportable electronic products, consumers have high expectations regardingthe quality, functionality, and price of such products. The developmentof next-generation display devices has been focused on techniques thatare energy-saving and environmentally friendly.

Micro LED technology is an emerging flat panel display technology. MicroLED displays drive an array of addressed micro LEDs. Micro LED displayscan produce seamless images with a wide viewing angle, high brightness,and high contrast. However, due to the small size of a micro LED,integration and packaging issues are one of the main obstacles forcommercialization of such products.

Using current manufacturing methods, micro LEDs are generally formed anddivided into several micro LED dies (e.g., micro-lighting dies) on awafer substrate and then transferred to another destination substrate.For example, the driving circuits and related circuits are formed on thedestination substrate to provide an array substrate (e.g., a TFT arraysubstrate), and the micro LED dies are then mounted on the arraysubstrate. Due to the small size of micro LED dies, the electricalconnection between the micro LED and the destination substrate oftenencounters many problems. For example, the micro LED dies can easilyfall off of the destination substrate, and therefore the maintenance orrepair of the electrical connection between the micro LED and thedestination substrate is a problem that needs to be taken care of.

Accordingly, it is desirable to develop a structure and method that caneffectively maintain or repair the electrical interconnection between asmall electronic component such as a micro LED and a destinationsubstrate.

SUMMARY

In accordance with some embodiments of the present disclosure, a displaydevice is provided. The display device comprises a substrate and aplurality of signal lines disposed on the substrate. At least one of thesignal lines comprises a main line, a plurality of first branch lines,and a plurality of second branch lines. The first branch lines areelectrically connected to the main line. The second branch lines areelectrically connected to the main line. A plurality of display units isdisposed on the substrate. At least one of the display units comprises aplurality of main pads, a plurality of redundant pads, and alight-emitting device. The light-emitting device is electricallyconnected to the main pads. At least one of the main pads iselectrically connected to at least one first branch line, and at leastone redundant pad is electrically connected to at least one secondbranch line.

In accordance with some embodiments of the present disclosure, a displaydevice is provided. The display device comprises a substrate and aplurality of signal lines. The signal lines are disposed on thesubstrate. One or more of the signal lines comprises a main line, aplurality of first branch lines, and a plurality of second branch lines.The first branch lines are electrically connected to the main line. Thesecond branch lines are electrically connected to the main line. Aplurality of display units is disposed on the substrate. One or moredisplay unit comprises a plurality of main pads, a plurality ofredundant pads, and a first light-emitting device. The firstlight-emitting device is electrically connected to the main pads. Atleast one main pad is electrically connected to one or more secondbranch lines, and at least one redundant pad is electricallydisconnected to the first branch lines.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 2A is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 2B illustrates a partial enlarged view of the region R in FIG. 2A.

FIG. 3 is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 4 is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 5 is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 6A is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 6B is a diagram of the top view of the display device in FIG. 6A.

FIG. 7A is a cross-sectional diagram of a portion of the display devicein accordance with some embodiments of the present disclosure.

FIG. 7B is a top-view diagram of the display device in FIG. 7A.

FIG. 7C is a cross-sectional diagram of a portion of the display devicein accordance with some other embodiments of the present disclosure.

FIG. 8 is a top-view diagram of a portion of the display device inaccordance with some embodiments of the present disclosure.

FIG. 9 is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 10 is a diagram of a portion of the display device in accordancewith some embodiments of the present disclosure.

FIG. 11A is a cross-sectional diagram of the display device along theline segment A-A′ in FIG. 1.

FIG. 11B is a top-view diagram of a portion of the display device inFIG. 1.

FIG. 12 is a cross-sectional diagram of a portion of the display devicein accordance with some embodiments of the present disclosure.

FIG. 13 is a cross-sectional diagram of a portion of the display devicein accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

The display device of the present disclosure and the manufacturingmethod thereof are described in detail in the following description. Inthe following detailed description, for purposes of explanation,numerous specific details and embodiments are set forth in order toprovide a thorough understanding of the present disclosure. The specificelements and configurations described in the following detaileddescription are set forth in order to clearly describe the presentdisclosure. It will be apparent, however, that the exemplary embodimentsset forth herein are used merely for the purpose of illustration, andthe concept of the present disclosure may be embodied in various formswithout being limited to those exemplary embodiments. In addition, thedrawings of different embodiments may use like and/or correspondingnumerals to denote like and/or corresponding elements in order toclearly describe the present disclosure. However, the use of like and/orcorresponding numerals in the drawings of different embodiments does notsuggest any correlation between different embodiments. In addition, inthis specification, expressions such as “first layer disposed on/over asecond layer”, may indicate the direct contact of the first layer andthe second layer, or it may indicate a non-contact state with one ormore intermediate layers between the first layer and the second layer.In the above situation, the first layer may not be in direct contactwith the second layer.

It should be noted that the elements or devices in the drawings of thepresent disclosure may be present in any form or configuration known tothose with ordinary skill in the art. In addition, the expressions “alayer overlying another layer”, “a layer is disposed above anotherlayer”, “a layer is disposed on another layer” and “a layer is disposedover another layer” may indicate that the layer is in direct contactwith the other layer, or that the layer is not in direct contact withthe other layer, there being one or more intermediate layers disposedbetween the layer and the other layer.

In addition, in this specification, relative expressions are used. Forexample, “lower”, “bottom”, “higher” or “top” are used to describe theposition of one element relative to another. It should be appreciatedthat if a device is flipped upside down, an element that is “lower” willbecome an element that is “higher”.

It should be understood that, although the terms first, second, thirdetc. may be used herein to describe various elements, components,regions, layers, portions and/or sections, these elements, components,regions, layers, portions and/or sections should not be limited by theseterms. These terms are only used to distinguish one element, component,region, layer, portion or section from another element, component,region, layer or section. Thus, a first element, component, region,layer, portion or section discussed below could be termed a secondelement, component, region, layer, portion or section without departingfrom the teachings of the present disclosure.

It should be understood that this description of the exemplaryembodiments is intended to be read in connection with the accompanyingdrawings, which are to be considered part of the entire writtendescription. The drawings are not drawn to scale. In addition,structures and devices are shown schematically in order to simplify thedrawing.

The terms “about” and “substantially” typically mean +/−20% of thestated value, more typically +/−10% of the stated value, more typically+/−5% of the stated value, more typically +/−3% of the stated value,more typically +/−2% of the stated value, more typically +/−1% of thestated value and even more typically +/−0.5% of the stated value. Thestated value of the present disclosure is an approximate value. Whenthere is no specific description, the stated value includes the meaningof “about” or “substantially”.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this disclosure belongs. It should be appreciated that,in each case, the term, which is defined in a commonly used dictionary,should be interpreted as having a meaning that conforms to the relativeskills of the present disclosure and the background or the context ofthe present disclosure, and should not be interpreted in an idealized oroverly formal manner unless so defined.

In addition, in some embodiments of the present disclosure, termsconcerning attachments, coupling and the like, such as “connected” and“interconnected,” refer to a relationship wherein structures are securedor attached to one another either directly or indirectly throughintervening structures, as well as both movable or rigid attachments orrelationships, unless expressly described otherwise.

In addition, the term “longitudinal direction” is defined as thedirection along or parallel to the long axis of an object. The long axisis defined as a line extending through the center of an objectlengthwise. For an elongated or oblong object, the long axis correspondsmost nearly to its greatest dimension lengthwise. For an object thatdoes not have a definite long axis, the long axis is referred to thelong axis of a minimum rectangle that can encircle the object.

The terms “main pad” and “redundant pad” used in the present disclosuremay be interchangeable according to the relative positions and differentstatuses of a light-emitting device in a display unit. In some cases,“main pad” is defined as the pad that has a larger overlapping area inthe Z direction with connecting posts (which will be described in detailin FIG. 11A) of a functional light-emitting device. On the other hand,“redundant pad” is defined as the pad that has a smaller overlappingarea in the Z direction with connecting posts of a functionallight-emitting device. In some embodiments, the overlapping area betweenthe redundant pad and the connecting post may be zero, i.e. theredundant pad and the connecting post do not overlap.

In addition, the term “functional light-emitting device” means that alight-emitting device may produce the images having different grayscales according to the different received signals. On the other hand,the term “dysfunctional light-emitting device” means that alight-emitting device may flicker or constantly emit light when an offsignal is given. Alternatively, the term “dysfunctional light-emittingdevice” may refer to a light-emitting device that may have thebrightness that is different from the surrounding light-emittingdevices.

The disclosure may be used in an electronic device. The electronicdevice may include, but is not limited to, a display device, touchdisplay device or a sensing device. For example, the electronic devicesmay be arranged in juxtaposition to form a tiled electronic device inaccordance with some embodiments. The display device may include, but isnot limited to, an OLED display, a QLED display, a LED display (e.g.micro LED or mini LED) or a flexible display.

In accordance with some embodiments of the present disclosure, aplurality of main pads and a plurality of redundant pads are disposed onthe substrate (e.g., the destination substrate) of the display device.The redundant pads may serve as spare pads in case the electricalconnection between the main pad and an electronic component such as alight-emitting device is dysfunctional or damaged. With such aconfiguration, the repair and replacement of the damaged electronicdevice may become effective. In addition, in accordance with someembodiments of the present disclosure, the dies that correspond to thesubpixels of the display device may be packaged together on anintermediate substrate before they are transferred to the destinationsubstrate so that the time required for the transfer may be reduced.

FIG. 1 is a diagram of a portion of the display device 10 in accordancewith some embodiments of the present disclosure. It should be understoodthat additional features may be added to the display device inaccordance with some embodiments of the present disclosure. Some of thefeatures described below may be replaced or eliminated in accordancewith some embodiments of the present disclosure. In addition, some ofthe features may be simplified or omitted for clarity.

Referring to FIG. 1, the display device 10 includes a first substrate102 and a plurality of signal lines S disposed on the first substrate102. In addition, the display device 10 includes a plurality of displayunits 200 disposed on the first substrate 102. The first substrate 102may be a destination substrate (such as an array substrate) of thedisplay device 10. The signal lines may provide signals to control thedisplay unit 200. The display unit 200 also includes a driving element(not illustrated) that is electrically connected to the signal lines. Insome embodiments, the driving element may include an active drivingelement such as a thin-film transistor (TFT). In some other embodiments,the driving elements may include a passive driving element. For example,the driving elements may be controlled by an IC or a microchip through apad.

In some embodiments, the material of the first substrate 102 mayinclude, but is not limited to, glass, quartz, sapphire, polycarbonate(PC), polyimide (PI), polyethylene terephthalate (PET), rubbers, glassfibers, other polymer materials, any other suitable substrate material,or a combination thereof. In some embodiments, the first substrate 102may be made of a metal-glass fiber composite plate, a metal-ceramiccomposite plate, a printed circuit board, or any other suitablematerial, but it is not limited thereto.

The signal lines S may include a plurality of main lines ML inaccordance with some embodiments. It should be understood that the mainlines ML represented by the solid lines and the dotted lines aredisposed on different horizontal levels (different layers in astructure). In some embodiments, the main lines ML may be the data lineor scan line on the first substrate 102. Specifically, the main lines MLmay provide different types of signals for the display unit 200. Forexample, in some embodiments, three of the main lines ML may provide thesignals for the p-electrodes of the display element (e.g., thelight-emitting device 206 described in the following context) in thedisplay unit 200 and one of the main lines ML may provide the signalsfor the n-electrode of the display element. In some other embodiments,three of the main lines ML may provide the signals for the n-electrodesof the display element and one of the main lines ML may provide thesignals for the p-electrode of the display element. In some embodiments,one of the main lines ML may provide the signals to control a commonelectrode. In addition, the signal lines may further include firstbranch lines BL1 and second branch lines BL2 in accordance with someembodiments. In some embodiments, the first branch line BL1 and thesecond branch line BL2 are each electrically connected to the main lineML. In other words, each main line ML is electrically connected to atleast a first branch line BL1 and at least a second branch line BL2 inaccordance with some embodiments.

In some embodiments, the main lines ML, the first branch line BL1 andthe second branch line BL2 each may be made of a conductive material.The conductive material used in forming the main lines ML, the firstbranch line BL1 and the second branch line BL2 may include, but is notlimited to, copper, aluminum, tungsten, titanium, gold, silver,molybdenum, copper alloys, aluminum alloys, tungsten alloys, titaniumalloys, gold alloys, silver alloys, molybdenum alloys, any othersuitable conductive materials, or a combination thereof.

In addition, the display unit 200 may include a plurality of main pads202, a plurality of redundant pads 204, and a light-emitting device 206electrically connected to the main pads 202. The main pads 202 mayprovide electrical connection between the signal lines (e.g., the mainlines or the branch lines) and the light-emitting device 206. Theredundant pads 204 may serve as spare pads in case the electricalconnection between the signal lines (e.g., the main line ML or the firstbranch line BL1) and the main pad 202, or between the main pad 202 andthe light-emitting device 206 is dysfunctional or damaged. In someembodiments, the main pad 202 is electrically connected to the firstbranch line BL1, and the redundant pad 204 is electrically connected tothe second branch line BL2. More specifically, the main pad 202 iselectrically connected to the main line ML via the first branch lineBL1, and the redundant pad 204 is electrically connected to the mainline ML via the second branch line BL2. In some embodiments, more thanone first branch lines BL1 may be disposed between the main pads 202 andthe main line ML. In some embodiments, more than one second branch linesBL2 may be disposed between the redundant pad 204 and the main line ML.

As shown in FIG. 1, since the first branch line BL1 and the secondbranch line BL2 are connected to the main pad 202 and the redundant pad204, which are disposed in different positions, the length of the firstbranch line BL1 may be different than the length of the second branchline BL2 in accordance with some embodiments. In some embodiments, thefirst branch line BL1 and the second branch line BL2 each may includeone or more turning portions TP. In addition, the width of the main lineML may be greater than the width of the first branch line BL1 and thesecond branch line BL2 in accordance with some embodiments. With such aconfiguration, the quality of the signals transmitted by the signallines will be more stable.

In some embodiments, the main pad 202 and the redundant pad 204 each maybe made of a metallic conductive material. In some embodiments, themetallic conductive material used in forming the main pad 202 and theredundant pad 204 may include, but is not limited to, copper, aluminum,molybdenum, tungsten, gold, chromium, nickel, copper alloys, aluminumalloys, molybdenum alloys, tungsten alloys, gold alloys, chromiumalloys, nickel alloys, any other suitable metallic materials, or acombination thereof. In some other embodiments, the main pad 202 and theredundant pad 204 each may be made of transparent conductive materials.In some embodiments, the transparent conductive materials for formingthe main pad 202 and the redundant pad 204 may include, but is notlimited to, indium tin oxide (ITO), tin oxide (SnO), indium zinc oxide(IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO),any other suitable transparent conductive materials, or a combinationthereof. In addition, the main pad 202 and the redundant pad 204 may bemade of different materials in accordance with some embodiments. In someother embodiments, the main pad 202 and the redundant pad 204 may bemade of the same material.

In some embodiments, the main pad 202 and the redundant pad 204 may beformed by using chemical vapor deposition, physical vapor deposition,electroplating process, electroless plating process, any other suitableprocesses, or a combination thereof. The chemical vapor deposition mayinclude, but is not limited to, low-pressure chemical vapor deposition(LPCVD), low-temperature chemical vapor deposition (LTCVD), rapidthermal chemical vapor deposition (RTCVD), plasma enhanced chemicalvapor deposition (PECVD), atomic layer deposition (ALD), or any othersuitable method. The physical vapor deposition may include, but is notlimited to, sputtering, evaporation, pulsed laser deposition (PLD), orany other suitable method.

In addition, the light-emitting device 206 may include an inorganiclight-emitting diode device (e.g., dies of light-emitting diode) inaccordance with some embodiments. As shown in FIG. 1, the light-emittingdevice 206 has three LED dies. In some embodiments, the inorganiclight-emitting diode device may be a mini LED device or a micro LEDdevice. For example, the cross-sectional area of the mini LED dies mayhave a length ranging from about 100 μm to about 200 μm and may have awidth ranging from about 100 μm to about 200 μm. In some embodiments,the mini LED dies may have a size ranging from about 100 μm×100 μm×100μm to about 200 μm×200 μm×200 μm. For example, the cross-sectional areaof the micro LED dies may have a length ranging from about 1 μm to about100 μm and may have a width ranging from about 1 μm to about 100 μm. Insome embodiments, the micro LED dies may have a size ranging from about1 μm×1 μm×1 μm to about 100 μm×100 μm×100 μm.

In some embodiments, the light-emitting device 206 may be formed ofmultiple flip-chip dies. In some embodiments, these flip-chip dies maybe packaged together on an intermediate substrate 208 before they aretransferred to the first substrate 102. For example, three flip-chipdies may be packaged on an intermediate substrate 208 first and then aretogether transferred to the first substrate 102 in accordance with someembodiments.

In some embodiments, the light-emitting device 206 may correspond to apixel region P in the display device 10. The pixel region P of thelight-emitting device 206 may include one or more subpixels for emittingthe lights of suitable colors. For example, in some embodiments, thepixel region P of the light-emitting device 206 may include a subpixelp1, a subpixel p2 and a subpixel p3 for emitting red light, green lightand blue light respectively. In some embodiments, the subpixel p1,subpixel p2 and subpixel p3 share a common p-electrode and thep-electrode is electrically connected to one main pad 202 (i.e. one mainline ML), while the n-electrodes of the subpixel p1, subpixel p2 andsubpixel p3 are electrically connected to three different main pads 202(i.e. three different main lines ML). In some embodiments, the subpixelp1, subpixel p2 and subpixel p3 share a common n-electrode and then-electrode is electrically connected to one main pad 202 (i.e. one mainline ML), while the p-electrodes of the subpixel p1, subpixel p2 andsubpixel p3 are electrically connected to three different main pads 202(i.e. three different main lines ML). However, it should be understoodthat the light-emitting device 206 may have another suitable amount ofsubpixels and another suitable circuit arrangement according to need insome other embodiments. In some embodiment, the region P may be definedas a region that is the same as the display unit 200.

It should be understood that the display unit 200 described in thepresent disclosure may refer to the following definitions as illustratedin FIGS. 2A-2B and FIG. 3 and so on in various circumstances. FIG. 2Aillustrates a portion of the display device 10 in accordance with someembodiments of the present disclosure. It should be understood thatseveral elements (e.g., the signal lines S, the main pads 202 theredundant pads and so on) are omitted in the figure for clarity. Asshown in FIG. 2A, the display device 10 includes a plurality oflight-emitting devices 206. Some of the light-emitting devices 206 arenon-dislocated and some of the light-emitting devices 206′ aredislocated. In this embodiment, an area having about 5×5 of thelight-emitting devices 206, the light-emitting devices 206′ or acombination of the light-emitting devices 206 and the light-emittingdevices 206′ (about twenty-five light-emitting devices) is randomlyselected, and then a region R including 3×3 of the light-emittingdevices 206 (nine light-emitting devices) that are all non-dislocated isselected.

Further referring FIG. 2B, FIG. 2B illustrates a partial enlarged viewof the region R in FIG. 2A. In order to clearly illustrate the relativepositions of the light-emitting devices 206, the light-emitting device206 disposed at the center of the region R is indicated as thelight-emitting device 206 c, and the light-emitting device 206 disposednext to the light-emitting device 206 c is indicated as thelight-emitting device 206 a in FIG. 2B. Specifically, the minimumdistance between the light-emitting device 206 c and each of thelight-emitting device 206 a is defined as a first distance d1, a seconddistance d2, a third distance d3 and a fourth distance d4. For example,the first distance d1, the second distance d2, the third distance d3 andthe fourth distance d4 may be defined as the minimum distances betweenthe intermediate substrate 208 c of the light-emitting device 206 c andthe intermediate substrate 208 a of the four adjacent light-emittingdevices 206 a respectively. The first distance d1, the second distanced2, the third distance d3 and the fourth distance d4 may be the same asone another or different from one another. In addition, the firstdistance d1, the second distance d2, the third distance d3 and thefourth distance d4 include a first perpendicular bisector PB1, a secondperpendicular bisector PB2, a third perpendicular bisector PB3 and afourth perpendicular bisector PB4 respectively. In some embodiment, thefirst distance d1, the second distance d2, the third distance d3 and thefourth distance d4 may be defined as the minimum distances between anencapsulating layer (e.g., as shown in FIG. 11A) of the light-emittingdevice 206 c and an encapsulating layer of the light-emitting device 206a.

Referring to FIG. 2B. In the embodiments where most of thelight-emitting devices 206 are non-dislocated, the display unit 200 isdefined as an area encircled by the perpendicular bisectors of theminimum distances between the light-emitting device 206 c that isdisposed at the center of the region R and the four adjacentlight-emitting devices 206 a. For example, in this embodiment, the firstperpendicular bisector PB1 of the first distance d1, the secondperpendicular bisector PB2 of the second distance d2, the thirdperpendicular bisector PB3 of the third distance d3 and the fourthperpendicular bisector PB4 of the fourth distance d4 define the displayunit 200.

Next, FIG. 3 illustrates a portion of the display device 20 inaccordance with some embodiments of the present disclosure. It should benoted that the same or similar elements in above and below contexts arerepresented by the same or similar reference numerals. The materials,manufacturing methods and functions of these elements are the same orsimilar to those described above, and thus will not be repeated herein.As shown in FIG. 3, the display device 20 includes a plurality oflight-emitting devices 206. Some of the light-emitting devices 206 arenon-dislocated and some of the light-emitting devices 206 are dislocated(which are indicated as dislocated light-emitting devices 206′). In thisembodiment, an area having about 5×5 of the light-emitting devices 206is randomly selected, and then a region R′ including 3×3 of thelight-emitting devices 206 that are mostly non-dislocated is selected.However, in this embodiment, the region R′ still includes somedislocated light-emitting devices 206′.

In this embodiment, the display unit 200 of a light-emitting device 206that is non-dislocated in the region R′ is defined first. For example,the light-emitting device 206 c is defined in the similar way asdescribed in FIG. 2B. The light-emitting device 206 c is disposed nextto the light-emitting devices 206 a that are non-dislocated. Thereafter,the area of the display unit 200 defined by the non-dislocatedlight-emitting device 206 c may shift to the adjacent light-emittingdevices 206, including the non-dislocated light-emitting device 206 aand the dislocated light-emitting devices 206′, to define their displayunits 200.

In the embodiments where some of the light-emitting devices 206 aredislocated and some of the light-emitting devices 206 arenon-dislocated, the display unit 200 for a non-dislocated light-emittingdevice 206 is defined first. Specifically, the display unit 200 isdefined as an area encircled by the perpendicular bisectors of thesegments that are indicated as the minimum distances between thenon-dislocated light-emitting device 206 c and the four adjacentnon-dislocated light-emitting devices 206 a. The area of the abovedisplay unit 200 may then shift to the dislocated light-emitting devices206′ that are disposed on the dislocated main pads 202′ to define adisplay unit 200′ of the dislocated light-emitting devices 206′. Thearea of the display unit 200′ does not overlap that of the first-defineddisplay unit 200. For example, the display unit 200 may shift along theX direction or the Y direction in the embodiment shown in FIG. 3.

In addition, the display unit 200 may refer to an area encircled by themain lines ML (as shown in FIG. 1) in accordance with some embodimentsof the present disclosure. Specifically, the display unit 200 is definedas the area encircled by the four main lines ML electrically connectedto one light-emitting device 206. For example, the four main lines mayinclude the a main line ML that provides the signals for a commonelectrode of the light-emitting device 206 and three main lines ML thatprovide the signals for the other three electrodes of the light-emittingdevice 206. In other words, the four main lines may be the main linesthat provide the signals for one p-electrode and three n-electrodes, orone n-electrode and three p-electrodes of one light-emitting device 206.

Next, FIG. 4 is a diagram of a portion of the display device 30 inaccordance with some embodiments of the present disclosure. Thedifference between the display device 30 in FIG. 4 and the displaydevice 10 in FIG. 1 is that the first branch line BL1 partially overlapsthe second branch line BL2 in the embodiment shown in FIG. 4.Specifically, in this embodiment, the first branch line BL1 and thesecond branch line BL2 may be disposed on different layers (e.g.,corresponding to different metal layers or fabricated in the differentprocesses), and the first branch line BL1 overlaps the second branchline BL2 at a region L near the position where the first branch line BL1contacts the main line ML. The first branch line BL1 and the secondbranch line BL2 may overlap with each other and then separate to makecontact with the main pad 202 and the redundant pad 204 respectively. Inother embodiments where the first branch line BL1 and the second branchline BL2 may be disposed on the same layer (e.g., corresponding to thesame metal layer or fabricated in the same process), the first branchline BL1 and the second branch line BL2 may have the same conjunctionnear the position where the first branch line BL1 contacts the main lineML. In other words, the first branch line BL1 and the second branch lineBL2 may share the same circuit in the beginning and then separate intotwo circuits to contact with the main pad 202 and the redundant pad 204respectively.

Next, FIG. 5 illustrates a portion of the display device 40 inaccordance with some embodiments of the present disclosure. Thedifference between the display device 40 in FIG. 5 and the displaydevice 10 in FIG. 1 is that the number of main pads 202 is less than thenumber of redundant pads 204 in the display unit 200 in the embodimentshown in FIG. 5. As shown in FIG. 5, the display device 40 may includemore than one set of redundant pads 204S (e.g., including four redundantpads 204) in case the electrical connection between the redundant pads204 and the signal lines S or between the redundant pads 204 and thelight-emitting device 206 is also damaged. For example, the displaydevice 40 includes three sets of redundant pads 204S. In some otherembodiments, the display device 40 may include 2 sets, 3 sets, 4 sets,or other suitable number sets of redundant pads 204S according to need.

In this embodiment, the display device 40 includes a non-dislocatedlight-emitting device 206 that is disposed on the original main pads 202and a dislocated light-emitting device 206′ that is disposed on thedislocated main pads 202′ (i.e. the original redundant pads 204). Inthis embodiment, a light-emitting device 206 was once disposed on theredundant pads 204′ as shown in FIG. 5, but was removed and replacedwith a new light-emitting device (i.e. the dislocated light-emittingdevice 206′) disposed on the dislocated main pads 202′. In someembodiments, the light-emitting device 206 may be removed due to poorelectrical connection between the light-emitting device 206 and the mainpads 202 or dysfunction of the light-emitting device 206.

Since the display device may include the dislocated light-emittingdevice 206′ in accordance with some embodiments, the position of thepixel region P of the display device may be altered so that the pitchesamong the pixel region P may be not uniform. In some cases, thedislocation of pixels will result in abnormal displays. As shown in FIG.5, in some embodiments, the minimum distance between a main pad 202′ anda redundant pad 204′ is defined as d5, and the minimum distance betweena main pad 202′ in one display unit 200 and a main pad 202 in anotherone display unit 200 is defined as d6. In some embodiments, the distanced5 is less than half the distance d6. In some embodiments, the minimumdistance between a main pad 202′ in a display unit 206′ and a main pad202 in another display unit 206 is defined as a minimum perpendiculardistance between a main pad 202′ in a display unit 206′ and a main pad202 in another display unit 206. As shown in FIG. 5, the main pad 202′has an outer extending line 81 that is close to the display unit 206.The main pad 202 has an outer extending line 82 that is close to thedisplay unit 206′. The minimum distance or the minimum perpendiculardistance described above may be defined as a distance between the outerextending line 81 and the outer extending line 82. It should be notedthat the distance between the main pad 202 and the redundant pad 204,and the distance between the main pads 202 should be well controlled sothat the image quality provided by the display device can be maintainedeven if the light-emitting device is dislocated.

Next, FIG. 6A illustrates a portion of the display device 50 inaccordance with some embodiments of the present disclosure. As shown inFIG. 6A, the area of the main pad 202 may be different from the area ofthe redundant pad 204 in accordance with some embodiments. However, thearea of the main pad 202 may be the same as that of the redundant pad204 in accordance with some other embodiments. In some embodiments, thearea of the main pad 202 may be greater than the area of the redundantpad 204. More specifically, FIG. 6B is a diagram of the top view of thedisplay device 50. It should be noted that most of the elements areomitted for clarity, and the connecting posts 520 (which will bedescribed in detail in FIG. 11A) of the light-emitting device 206 isillustrated in FIG. 6B to explain the relative positions of the mainpads 202 and the redundant pads 204. As shown in FIG. 6B, the area 202Aof the main pad 202 may be greater than the area 204A of the redundantpad 204 in accordance with some embodiments. However, both the areas ofthe main pad 202 and the redundant pad 204 should be large enough toencompass the connecting posts 520. In some embodiments, the main pads202 and the redundant pads 204 have overlapping areas if they are piledtogether along the Z direction, and the connecting posts 520 can bemounted on these overlapping areas.

Next, FIG. 7A illustrates a cross-sectional diagram of a portion of thedisplay device 60 in accordance with some embodiments of the presentdisclosure. The display device 60 includes a metal line 312 disposed onthe first substrate 102, and a passivation layer 308 disposed on thefirst substrate 102 and the metal line 312. The metal line 312 may beone of the signal lines of the display device 60. In this embodiment,the redundant pad 204 is disposed on the metal line 312. The redundantpad 204 is electrically connected to the metal line 312. The displaydevice 60 further includes a connecting layer 310 that is in electricalconnection with the redundant pad 204 and the main pad 202. Theconnecting layer 310 is disposed on the redundant pad 204 and thepassivation layer 308. In addition, the connecting layer 310 is disposedbetween the redundant pad 204 and the main pad 202. In this embodiment,the light-emitting device 206 may be disposed on the main pad 202. Insome embodiments, the light-emitting device 206 may be disposed in therecess formed by the main pad 202. In this embodiment, the main pad 202is disposed on the upper layer of the display device 60 while theredundant pad 204 is disposed on the lower layer. However, in some otherembodiments, the redundant pad 204 may be disposed on the upper layerwhile the main pad 202 may be disposed on the lower layer.

As shown in FIG. 7A, the main pad 202 and the redundant pad 204 may bedisposed on different layers in the structure of the display device 60in accordance with some embodiments. In other words, the main pad 202and the redundant pad 204 may be disposed on different horizontal planes(e.g., the different X-Y planes in the Z direction shown in FIG. 7A).With such a configuration, more space may be saved in the display unit.In addition, FIG. 7B illustrates a top-view diagram of the displaydevice 60 in FIG. 7A. It should be understood that the elements otherthan the main pads 202 and the redundant pads 204 are omitted in FIG.7B. As shown in FIG. 7B, the main pad 202 may partially overlap theredundant pad 204 along the Z direction in accordance with someembodiments. In some embodiments, the Z direction may refer to thenormal direction of the first substrate 102.

Next, FIG. 7C illustrates a cross-sectional diagram of a portion of thedisplay device 60 in accordance with some other embodiments of thepresent disclosure. In some embodiments, the light-emitting device 206disposed on the main pad 202 shown in FIG. 7A is removed and a new oneis disposed on the original position of the redundant pad 204, whichserves as the new main pad. As shown in FIG. 7C, the dislocatedlight-emitting device 206′ is disposed on the newly-defined main pad,i.e. the dislocated main pads 202′. In some embodiments, the dislocatedlight-emitting device 206′ may be disposed in the recess formed by thedislocated main pads 202′. In some embodiments, while the originallight-emitting device 206 is removed, the original main pad 202 may bedamaged. However, since the original redundant pad 204 (i.e. thedislocated main pads 202′) remains intact, it may serve as the new mainpad for electrical connection.

Next, FIG. 8 illustrates a top-view diagram of a portion of the displaydevice 70 in accordance with some embodiments of the present disclosure.As shown in FIG. 8, the redundant pads 204 may be rotated so that thereis an acute angle θ between the redundant pads 204 and main pads 202 inaccordance with some embodiments. Specifically, the main pads 202 mayextend along a first longitudinal direction L₁ and the redundant pads204 may extend along a second longitudinal direction L₂. In someembodiments, the acute angle θ between the first longitudinal directionL₁ and the second longitudinal direction L₂ is in a range from 5 degreesto 85 degrees or from about 30 degrees to about 60 degrees. With such aconfiguration, the area required for the arrangement of the main pads202 and the redundant pads 204 may be reduced. In some embodiments, themain pads 202 and the redundant pads 204 may be disposed on differenthorizontal planes or different metal layers. (as shown in FIG. 7A). Insome embodiments, the main pads 202 and the redundant pads 204 may bedisposed on the same horizontal plane or the same metal layer. In someembodiments, the main pads 202 and the redundant pads 204 may be formedby different processes (e.g., different deposition processes ordifferent lithography processes).

As shown in FIG. 8, the light-emitting device 206 may be disposed on theunrotated main pads 202 while the redundant pads 204 are rotated inaccordance with some embodiments. In some embodiments, thelight-emitting device 206 disposed on the unrotated main pads 202 isremoved and a new one is disposed on the original position of therotated redundant pads 204, which serves as the new main pads. Thedislocated light-emitting device 206′ is disposed on the newly-definedmain pads, i.e. the dislocated main pads 202′ which are rotated.

Next, FIG. 9 illustrates a portion of the display device 80 inaccordance with some embodiments of the present disclosure. As shown inFIG. 9, the display device 80 includes both the dysfunctionallight-emitting devices 206 and the dislocated light-emitting devices206′ disposed in the display unit 200. In this embodiment, thedysfunctional light-emitting devices 206 are not removed, and are lefton the first substrate 102, and new ones are disposed on thenewly-defined main pads, i.e. the dislocated main pads 202′. Thedislocated main pads 202′ are electrically connected to the secondbranch lines BL2, and the dislocated light-emitting devices 206′ aredisposed on the dislocated main pads 202′. In addition, as shown in FIG.9, the first branch lines BL1 that were electrically connected to thenewly-defined redundant pads 204′ (the original main pads) are cut off(indicated as CT in FIG. 9). The dysfunctional light-emitting devices206 are disposed on the redundant pads 204′. In other words, thedysfunctional light-emitting devices 206 are not electrically connectedto the first branch lines BL. In some embodiments, a laser cuttingprocess may be performed to cut off the first branch lines BL1.

Next, FIG. 10 illustrates a portion of the display device 90 inaccordance with some embodiments of the present disclosure. As shown inFIG. 10, the light-emitting device may be formed of a single flip-chipdie in accordance with some embodiments. In this embodiment, the pixelregion P of the light-emitting device 306 may have one subpixel. Thelight-emitting device 306 disposed in the different display units 200may include the pixels for emitting the lights of different colors inaccordance with some embodiments. In this embodiment, since thelight-emitting device 306 is formed of a single flip-chip die, thelight-emitting device 306 may include two connecting posts 520 forelectrical connection. Therefore, the display unit 200 may include twomain pads 202 disposed on the first substrate 102 to electricallyconnect with the first branch line BL1 in this embodiment. In some otherembodiments, the light-emitting device 306 may be formed of avertical-type die.

Next, FIG. 11A illustrates a cross-sectional diagram of the displaydevice 10 along the line segment A-A′ in FIG. 1. It should be understoodthat some of the elements such as the wavelength conversion layer andthe light-shielding layer etc. are omitted in FIG. 1 for clarity, andthese elements will be described in detail in the following context. Asshown in FIG. 11A, the display device 10 may include threelight-emitting units 206U and each of them may correspond to onesubpixel in the display unit 200. The light-emitting unit 206U mayinclude the first substrate 102, the light-emitting device 206 disposedon the first substrate 102 and a wavelength conversion layer disposed onthe light-emitting device 206 and so on. Specifically, thelight-emitting device 206 may include a first semiconductor layer 502, asecond semiconductor layer 506 and a quantum well layer 504 disposedbetween the first semiconductor layer 502 and second semiconductor layer506.

In some embodiments, the first semiconductor layer 502 may be made ofthe III-V compounds having dopants of the first conductivity type, e.g.gallium nitride having p-type conductivity (p-GaN). In some embodiments,the quantum well layer 504 may include a homogeneous interface, aheterogeneous interface, a single quantum well (SQW) or a multiplequantum well (MQW). The material of the quantum well layer 504 mayinclude, but is not limited to, indium gallium nitride, a galliumnitride or a combination thereof. In some embodiments, the secondsemiconductor layer 506 may be made of the III-V compounds havingdopants of the second conductivity type that is different from the firstconductivity type, e.g. gallium nitride having n-type conductivity(n-GaN). In addition, the above III-V compounds may include, but is notlimited to, indium nitride (InN), aluminum nitride (AlN), indium galliumnitride (InGaN), aluminum gallium nitride (AlGaN), aluminum indiumgallium nitride (AlGaInN) or a combination thereof.

In some embodiments, the first semiconductor layer 502, the quantum welllayer 504 and the second semiconductor layer 506 may be formed by usingan epitaxial growth process. For example, the epitaxial growth processmay include metal organic chemical vapor deposition (MOCVD), molecularbeam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), liquid phaseepitaxy (LPE), any other suitable processes or a combination thereof.

The light-emitting device 206 may further include a first electrode 508and a second electrode 510. The first electrode 508 and the secondelectrode 510 may serve as the n-electrode p-electrode of thelight-emitting device 206. In some embodiments, the first electrode 508and the second electrode 510 may be made of a conductive material. Theconductive material may include, but is not limited to, copper,aluminum, tungsten, titanium, gold, silver, molybdenum, platinum,nickel, copper alloys, aluminum alloys, tungsten alloys, titaniumalloys, gold alloys, silver alloys, molybdenum alloys, platinum alloys,nickel alloys, any other suitable conductive materials, or a combinationthereof. In some embodiments, the first electrode 508 and the secondelectrode 510 may be formed by using chemical vapor deposition, physicalvapor deposition, electroplating process, electroless plating process,any other suitable processes, or a combination thereof.

In addition, the light-emitting device 206 may further include a firstinsulating layer 512, a second insulating layer 514 and a thirdinsulating layer 516 to provide electrical insulation between differentelements. In some embodiments, the first insulating layer 512, thesecond insulating layer 514 and the third insulating layer 516 may bemade of insulating materials. The insulating materials may include, butare not limited to, silicon nitride, silicon oxide, silicon oxynitride,any other suitable materials or a combination thereof. In someembodiments, the first insulating layer 512, the second insulating layer514 and the third insulating layer 516 may be formed by using chemicalvapor deposition or coating.

The light-emitting device 206 may also include a connecting layer 518and a connecting post 520 disposed between the second electrode 510 andthe main pad 220. The connecting layer 518 and the connecting post 520may provide electrical connection between the light-emitting device 206and the main pad 202. In addition, the connecting post 520 may penetratethrough an encapsulating layer 522 to contact with the main pad 202. Theconnecting layer 518 and the connecting post 520 may be made ofconductive materials. In some embodiments, conductive materials mayinclude, but are not limited to, copper, aluminum, molybdenum, tungsten,gold, chromium, nickel, copper alloys, aluminum alloys, molybdenumalloys, tungsten alloys, gold alloys, chromium alloys, nickel alloys,any other suitable metallic materials, or a combination thereof. In someembodiments, the connecting layer 518 and the connecting post 520 may beformed by using chemical vapor deposition, physical vapor deposition,electroplating process, electroless plating process, any other suitableprocesses, or a combination thereof.

In addition, the encapsulating layer 522 may be made of organicmaterial, inorganic material, or combinations thereof. In someembodiments, the inorganic material may include, but is not limited to,silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, anyother suitable materials, or a combination thereof. In some embodiments,the organic material may include, but is not limited to, epoxy resins,acrylic resins such as polymethylmetacrylate (PMMA), benzocyclobutene(BCB), polyimide, and polyester, polydimethylsiloxane (PDMS),polyfluoroalkoxy (PFA), epoxy, any other suitable materials, or acombination thereof. In some embodiments, the encapsulating layer 522may be formed by using chemical vapor deposition, spin coating, printingor a combination thereof.

In addition, the light-emitting unit 206U may further include a secondsubstrate 402 disposed opposite to the first substrate 102 and awavelength conversion layer (e.g., including the wavelength conversionlayers 404R, 404G and 404B) disposed between the encapsulating layer 522and the second substrate 402. The second substrate 402 may serve as acover substrate. The wavelength conversion layers 404R, 404G and 404Bmay convert the light emitted from the quantum well layer 504 into thecolors that are needed. For example, the wavelength conversion layers404R, 404G and 404B may convert the light emitted from the quantum welllayer 504 into red light, green light and blue light in accordance withembodiments.

In some embodiments, the quantum well layer 504 may emit white light,blue light or UV light. In the embodiments where the quantum well layer504 emits UV light, the wavelength conversion layers 404R, 404G and 404Bmay further include the quantum dot layers (not illustrated). Thequantum dot layer may include polymer or glass matrix and quantum dotmaterials. The quantum dot material may have a core-shell structure. Thecore structure may include, but is not limited to, CdSe, CdTe, CdS, ZnS,ZnSe, ZnO, ZnTe, InAs, InP, GaP, or any other suitable materials, or acombination thereof. The shell structure may include, but is not limitedto, ZnS, ZnSe, GaN, GaP, or any other suitable materials, or acombination thereof.

In addition, the light-emitting unit 206U may further include thelight-shielding layer 406 disposed adjacent to the wavelength conversionlayers 404R, 404G and 404B to enhance the contrast of luminance. In someembodiments, the light-shielding layer 406 may be made of opaquematerials such as a black matrix material. The black matrix material maybe made of organic resins, glass pastes or a combination thereof. Theblack matrix material may further include, but is not limited to, blackpigments, metallic particles (e.g. particles of nickel, aluminum,molybdenum, or alloys thereof), metal oxide particles (e.g. particles ofchromium oxide), or metal nitride particles (e.g. particles of chromiumnitride). In some embodiments, the wavelength conversion layer 404 andthe light-shielding layer 406 may be formed by using chemical vapordeposition, coating or printing.

In some embodiments, the light-emitting unit 206U may further include aprotecting layer 408 overlying or disposed on the wavelength conversionlayers 404R, 404G and 404B, and the light-shielding layer 406. Theprotecting layer 408 may prevent the wavelength conversion layer and thelight-shielding layer 406 from being affected by the outer environment.The protecting layer 408 may be made of organic materials or inorganicmaterials. In some embodiments, the inorganic material may include, butis not limited to, silicon nitride, silicon oxide, silicon oxynitride,aluminum oxide, any other suitable protective materials, or acombination thereof. In some embodiments, the organic material mayinclude, but is not limited to, epoxy resins, acrylic resins such aspolymethylmetacrylate (PMMA), benzocyclobutene (BCB), polyimide, andpolyester, polydimethylsiloxane (PDMS), any other suitable protectivematerials, or a combination thereof.

In addition, the light-emitting unit 206U may further include a bufferlayer 410 disposed between the protecting layer 408 and theencapsulating layer 522. The buffer layer 410 may cover the secondsemiconductor layer 506. The buffer layer 410 may prevent the current orheat produced by the light-emitting device 206 from affecting thewavelength conversion layer. In some embodiments, the buffer layer 410may be adhesive so that the protecting layer 408 may be affixed to thelight-emitting device 206. The buffer layer 410 may be made of organicmaterials or inorganic materials. The organic insulating material mayinclude, but is not limited to, polyamide, polyethylene, polystyrene,polypropylene, polyester, polyimide, polyurethane, silicones,polyacrylate, benzo-cyclo-butene (BCB), polyvinylpyrrolidone (PVP),polyvinylfluoride (PVF), polyvinylidene fluoride (PVDF),polytetrafluoroethylene (PTFE), polymethylmetacrylate (PMMA),polydimethylsiloxane (PDMS), or a combination thereof. The inorganicinsulating material may include, but is not limited to, silicon nitride,silicon oxide, silicon oxynitride, aluminum oxide, or a combinationthereof. In some embodiments, the buffer layer 410 may be formed byusing chemical vapor deposition or coating.

On the other hand, the light-emitting unit 206U may also include anadhesive layer 524 disposed between the light-emitting device 206 andthe first substrate 102. Specifically, the adhesive layer 524 may bedisposed between the encapsulating layer 522 and the first substrate 102so that the light-emitting device 206 may be affixed to the firstsubstrate 102. The adhesive layer 524 may be formed of any suitableadhesive material.

As shown in FIG. 11A, each area of the wavelength conversion layers404R, 404G, 404B may be greater than the area of the quantum well layer504. Specifically, the areas of the wavelength conversion layers 404R,404G and 404B are greater than the areas of the quantum well layer 504in each light-emitting unit 206U respectively. For example, as shown inFIG. 11A, the area A1 of the wavelength conversion layer 404R is greaterthan the area A2 of the quantum well layer 504. In addition, thewavelength conversion layer 404R, 404G or 404B may partially overlap themain pads 202. In some embodiments, the wavelength conversion layer404R, 404G or 404B may at least partially overlap the redundant pads204. In some embodiment, the area A1 is the area of the top surface(close to the second substrate 402) of the wavelength conversion layerfrom the perspective of the Z direction. The area A2 is the area of thetop surface (close to the second substrate 402) of the quantum welllayer 504 from the perspective of the Z direction.

In addition, FIG. 11B illustrates a top-view diagram of a portion of thedisplay device 10 in FIG. 1, which includes the line segment A-A′ andalso corresponds to the portion illustrated in FIG. 11A. As shown inFIG. 11B, the area of the wavelength conversion layer 404R, 404G or 404Bis greater than the area of the quantum well layer 504 in eachlight-emitting unit 206U. Moreover, with such a configuration, thewavelength conversion layers 404R, 404G and 404B would not have to alignwith the light-emitting unit 206U when the redundant pads 204 are used.

Next, FIG. 12 illustrates a cross-sectional diagram of a portion of thedisplay device 500 in accordance with some embodiments of the presentdisclosure. FIG. 12 illustrates the cross-sectional diagram of thedisplay device 500 in an aspect similar to the line segment B-B′ shownin FIG. 1. As shown in FIG. 12, the second semiconductor layer 506 maypartially overlap the light-shielding layer 406 in accordance with someembodiments. Specifically, the second semiconductor layer 506 maypartially overlap the light-shielding layer 406 in the Z direction asshown in FIG. 12. In addition, the first semiconductor layer 502 may atleast partially overlap the wavelength conversion layers 404R, 404G or404B in each light-emitting unit 206U in accordance with someembodiments. In some embodiments, wavelength conversion layers 404R,404G or 404B may entirely cover the first semiconductor layer 502. Insome embodiments, the light-shielding layer 406 may also partiallyoverlap the second electrode 510. With such a configuration, thewavelength conversion layers 404R, 404G and 404B may align with thequantum well layer 504 precisely. Therefore, the reflection of the firstelectrode 508 or the second electrode 510 may be reduced.

Next, FIG. 13 illustrates a cross-sectional diagram of a portion of thedisplay device 600 in accordance with some embodiments of the presentdisclosure. FIG. 13 illustrates the cross-sectional diagram of thedisplay device 600 in an aspect similar to the line segment B-B′ shownin FIG. 1. The difference between the display device 600 in FIG. 13 andthe display device 500 in FIG. 12 is that the display device 600 furtherincludes a connecting pad 602 disposed between the connecting post 520and the main pad 20 in the embodiment shown in FIG. 13. The connectingpad 602 may extend from the bottom of the connecting post 520 toward themain pad 202 along the X direction (e.g., along the direction that issubstantially parallel to the top surface of the first substrate 102).The connecting pad 602 may extend outward to partially overlap thelight-shielding layer 406 in accordance with some embodiments. In someembodiments, the main pad 202 may partially overlap the light-shieldinglayer 406. In some embodiments, the light-shielding layer 406 mayentirely cover the main pad 202. In addition, as shown in FIG. 13, theconnecting post 520 may partially overlap the connecting pad 602 inaccordance with some embodiments. In some embodiments, the connectingpost 520 may entirely overlap the connecting pad 602. With theconfiguration described above, the risk of short occurring near thecontact position of the connecting post 520 and the main pad 202 may bereduced. The connecting pad 602 may be made of a conductive material. Insome embodiments, the connecting pad 602 may be made of the materialssimilar to that of the connecting post 520 or the main pad 202.

To summarize the above, the present disclosure provides a displaystructure including the design of main pads and redundant pads forelectrical connection between the integrated light-emitting device andthe destination substrate. The redundant pads may serve as spare pads incase the electrical connection between the main pad and a light-emittingdevice is dysfunctional or damaged. With such a configuration, therepair and replacement of the damaged light-emitting device may becomeeffective. In addition, in accordance with some embodiments of thepresent disclosure, the dies that correspond to the subpixels of thedisplay device may be packaged together before they are transferred tothe destination substrate so that the time required for the transfer maybe reduced.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. For example, it will be readily understood by one ofordinary skill in the art that many of the features, functions,processes, and materials described herein may be varied while remainingwithin the scope of the present disclosure. Moreover, the scope of thepresent application is not intended to be limited to the particularembodiments of the process, machine, manufacture, composition of matter,means, methods and steps described in the specification. As one ofordinary skill in the art will readily appreciate from the presentdisclosure, processes, machines, manufacture, compositions of matter,means, methods, or steps, presently existing or later to be developed,that perform substantially the same function or achieve substantiallythe same result as the corresponding embodiments described herein may beutilized according to the present disclosure. Accordingly, the appendedclaims are intended to include within their scope such processes,machines, manufacture, compositions of matter, means, methods, or steps.In addition, each claim constitutes an individual embodiment, and theclaimed scope of the present disclosure also includes the combinationsof the claims and embodiments. The features of the various embodimentscan be used in any combination as long as they do not depart from thespirit and scope of the present disclosure.

What is claimed is:
 1. A display device, comprising: a substrate; aplurality of signal lines disposed on the substrate, and the pluralityof signal lines comprising a first main line and a second main line; anda plurality of display units disposed on the substrate, and at least oneof the plurality of display units comprising: a first main pad and asecond main pad; a first redundant pad and a second redundant pad; and alight-emitting device including a first electrode and a secondelectrode; wherein the first main line is electrically connected to thefirst electrode of the light-emitting device, the first main pad and thefirst redundant pad, and the second main line is electrically connectedto the second electrode of the light-emitting device, the second mainpad and the second redundant pad.
 2. The display device as claimed inclaim 1, wherein the first main line provides a first signal for thefirst electrode of the light-emitting device, and the second main lineprovides a second signal for the second electrode of the light-emittingdevice.
 3. The display device as claimed in claim 2, wherein the firstelectrode is an n-electrode and the second electrode is a p-electrode.4. The display device as claimed in claim 3, wherein the light-emittingdevice corresponds to a pixel region comprising a plurality ofsubpixels, the plurality of subpixels share the second electrode.
 5. Thedisplay device as claimed in claim 3, wherein the light-emitting devicecorresponds to a pixel region comprising one subpixel, and the subpixelis electrically connected to the first electrode and the secondelectrode.
 6. The display device as claimed in claim 1, wherein thefirst main pad and the first redundant pad are disposed on differentmetal layers.
 7. The display device as claimed in claim 6, wherein thefirst main pad partially overlaps the first redundant pad.
 8. Thedisplay device as claimed in claim 6, wherein the at least one of theplurality of display units further comprises: a wavelength conversionlayer disposed over the light-emitting device; and a light-shieldinglayer disposed adjacent to the wavelength conversion layer; and whereinthe light-emitting device further comprises: a first semiconductorlayer; a second semiconductor layer disposed on the first semiconductorlayer; and a quantum well layer disposed between the first semiconductorlayer and the second semiconductor layer.
 9. The display device asclaimed in claim 8, wherein an area of the wavelength conversion layeris greater than an area of the quantum well layer.
 10. The displaydevice as claimed in claim 8, wherein the second semiconductor layerpartially overlaps the light-shielding layer.
 11. The display device asclaimed in claim 8, wherein the first semiconductor layer at leastpartially overlaps the wavelength conversion layer.
 12. The displaydevice as claimed in claim 8, wherein the first main pad at leastpartially overlaps the light-shielding layer.
 13. The display device asclaimed in claim 8, wherein the first redundant pad at least partiallyoverlaps the wavelength conversion layer.
 14. The display device asclaimed in claim 1, wherein a minimum distance between the first mainpad and the first redundant pads is less than half of a minimum distancebetween the first main pad in one of the plurality of display units andthe first main pad in another one of the plurality of display units. 15.The display device as claimed in claim 1, wherein an area of the firstmain pad is different from an area of the first redundant pad.
 16. Thedisplay device as claimed in claim 1, wherein the first main pad extendsalong a first longitudinal direction and the first redundant pad extendsalong a second longitudinal direction, wherein an acute angle betweenthe first longitudinal direction and the second longitudinal directionis in a range from 5 degrees to 85 degrees.